“WOW” You want efficient integration of device connectivity in the SMT process

WOWAs device connection technology pioneers, we impress with intelligent product details”SMT_Process_Line_704x250px

Increasing requirements such as the demand for miniaturisation, higher functional densities of modules and cost-effective manufacturing processes have led to changes to PCB assembly processes. SMT (surface-mount technology) is being increasingly used in practice instead of conventional through-hole technology (THT). Indeed, the SMT process has now established itself as the accepted standard in the manufacture of electronic components.

The connection system can be integrated in the SMT process in two ways: by means of THR (through-hole reflow) or SMD (surface-mount device) technology. A combination of the two approaches is also possible.Banner_Whitepaper_EN_Sub

You can read our latest SMT Process White Paper on the integration of device connection technology  in the SMT process.

Alternatively, you can download our brochure “Making surface-mount technology faster and more efficient” from our OMNIMATE® Device connection technology section, read further online about our solutions offering on our website, or please feel free to call us on 0845 094 2006

Weidmüller– Your partner in Industrial Connectivity

We look forward to sharing ideas with you – Let’s Connect

This post was updated by Lesley Young from Weidmüller UK.

This entry was posted in Device Connectivity, SMT Process, Weidmuller, WOW and tagged , , , , , , , , , , , , . Bookmark the permalink.

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