Increasing requirements such as the demand for miniaturisation, higher functional densities of modules and cost-effective manufacturing processes have led to changes to PCB assembly processes. SMT (surface-mount technology) is being increasingly used in practice instead of conventional through-hole technology (THT). Indeed, the SMT process has now established itself as the accepted standard in the manufacture of electronic components.
The connection system can be integrated in the SMT process in two ways: by means of THR (through-hole reflow) or SMD (surface-mount device) technology. A combination of the two approaches is also possible.
You can read our latest SMT Process White Paper on the integration of device connection technology in the SMT process.
Alternatively, you can download our brochure “Making surface-mount technology faster and more efficient” from our OMNIMATE® Device connection technology section, read further online about our solutions offering on our website, or please feel free to call us on 0845 094 2006
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This post was updated by Lesley Young from Weidmüller UK.