“Your future lies in SMD assembly – OMNIMATE signal LSF-SMD provides more design freedom”
Maximum freedom with regard to PCB design calls for flexible terminal solutions that can also establish secure contacts with composite PCBs made from glass, ceramic or aluminium. Only in this way can you achieve quality-assured and efficient PCB assembly.
With our new LSF-SMD family, we are satisfying demands for fully-automatic PCB surface installation using the SMD soldering procedure. Two soldering pads per pole provide a high level of mechanical stability according to IPC A 610 Class 2. “PUSH IN” technology enables a secure connection without the use of tools. The 3.50 mm, 5.00 mm and 7.50 mm pitches and the 90°, 135° and 180° conductor outlet directions cover a multitude of device requirements and offer high component density with a maximum connection cross-section of 1.5 mm².
Use of the distortion-free insulating material LCP, which is resistant to high temperatures and has a moisture level of MSL 1, enables a high level of dimensional stability, thus guaranteeing co-planarity for the reflow soldering process without the need for a drying phase beforehand.
Fast wire connection method: The proven “PUSH IN” direct connectivity enables secure contacts up to 1.5 mm² without the need for tools. Conductors can be released simply and quickly by pressing the release button.
Efficient assembly: Automatic assembly is supported by the tapeon-reel packaging in standard belt widths. Pick and-Place pads guarantee reliable attaching and setting down.
Reliable processing: Use of the LCP insulating material means that assembly can take place directly during the SMT process without the need for pre-drying. There is no risk of blisters forming.
For speedy searching on our website use our new webcode search; enter a hash tag followed by 5 digits in the search box to take you directly to a product range. For 3.5mm pitch LSF-SMD search for #01035, for 5.00mm #01037 and for 7.50mm #01039 Alternatively, please feel free to call us on 0845 094 2006.
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This post was updated by Lesley Young from Weidmüller UK.